- Giới tính:
- Nam
- Sinh nhật:
- 10/5/99 (Tuổi: 25)
- Nghề nghiệp:
- BGA Package Underfill Epoxy
bgapackage
New Member, Nam, 25
- bgapackage được nhìn thấy lần cuối:
- 27/10/22
- Đang tải...
- Đang tải...
-
Giới thiệu
- Giới tính:
- Nam
- Sinh nhật:
- 10/5/99 (Tuổi: 25)
- Nghề nghiệp:
- BGA Package Underfill Epoxy
Electronic products of aerospace and navigation, motor vehicles, automobiles, outdoor LED lighting, solar energy and military enterprises with high reliability requirements, solder ball array devices (BGA/CSP/WLP/POP) and special devices on circuit boards are all facing microelectronics. The trend of miniaturization, and thin PCBs with a thickness of less than 1.0mm or flexible high-density assembly substrates, solder joints between devices and substrates become fragile under mechanical and thermal stress.Tương tác